Experimental and modeling stress concentration factor (SCF) of a tension poly lactic acid (PLA) plate with two circular holes

Ahmed Esmael Mohan, Hiyam Adil Habeeb, Ahmed Hadi Abood

Abstract


The design of high performance aircraft structures frequently includes various shape and size discontinuities for various purposes. The zones near to these notches become critical regions under various working loading. The stress concentration factor (SCF) and tensile strength degradation of poly lactic acid (PLA) plates are addressed in the current study through a combination of experimental and numerical studies using finite element (FE) modeling techniques. The present work performs stress concentration factor (SCF) of rectangular plates with two symmetrical circular holes under uniaxial tension load of two various types (PLA, PLA/15%carbon), which were determined in the current work experimentally and numerically using finite element method with help of Ansys software. The results of experimental test showed decay in tensile modulus and tensile strength is less than that of using plates without holes by (10%, 22.1%) for (PLA, PLA/15%carbon) respectively, and the apparent stress concentration factor is (3.33, 3.61) respectively. And showed decay in tensile strength is less than that of using plates without holes by (28.35%, 27.77%) for (PLA, PLA/15%carbon) respectively, due to the concentration of stresses around the holes. A finite element analysis is carried out and the outcomes have been estimated with experimental results for checking the efficient use of this article. The numerical results show the Von Mises stress distribution and stress concentration factor is (2.16, 2.35) for (PLA, PLA/15%carbon) respectively.

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DOI: http://dx.doi.org/10.21533/pen.v7i4.916

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Copyright (c) 2019 Ahmed Esmael Mohan, Hiyam Adil Habeeb, Ahmed Hadi Abood

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License.

ISSN: 2303-4521

Digital Object Identifier DOI: 10.21533/pen

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License